Physical Deposition Systems

SCS PDS 2010 LABCOATER – Parylene Coater

Details

SCS PDS 2010 LABCOATER is a dimer to coating evaporation system to obtain Parylene coatings of required thicknesses and compositions. This unique system allows to produce Parylene coatings that can be applied to components such as circuit boards, sensors, wafers, medical devices, MEMS and elastomeric components in any type of samples. Currently we can provide Parylene C and Parylene N coatings with wide range of thicknesses.

  • Dielectric Strength – 5.600V/mil
  • Dielectric Constant (60Hz) – 3.15
  • Water Vapor Transmission Rate – 0.08 (90% RH, 37ºC)
  • Continuous Service Temperature – 80ºC
  • Thermal Conductivity at 25ºC – 0.084

Parylene is considered by many to be the very best thin film conformal coating for environmental protection particularly in high reliability applications. It is the coating of choice to ruggedize critical electronics, devices, and subassemblies in industries such as Aerospace, Defence and Medical.

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PLASMACOAT – DC sputtering system

Details

PLASMACOAT is a DC magnetron sputtering apparatus used for the deposition of metallic and semiconductor thin films and complex multilayer structures which are of crucial importance for many applications, including electronics, optoelectronics, and photonics.

The PlasmaCoat uses a Thin Film Solutions patented reactive magnetron sputtering process resulting in the production of dense and uniform thin films with outstanding durability for the manufacture of single or multilayer structures over up to 3-inch wafers. The target materials used in the PlasmaCoat are typically silicon (Si) and zirconium (Zr), both currently available, for the deposition of silica (SiO2) and zirconia (ZrO2), highly utilised as dielectric layers in semiconductor devices (e.g., gate oxides in transistors). Other target materials can be used in this system, including tantalum (Ta), hafnium (Hf), aluminium (Al), and zinc (Zn), for the deposition of both metal oxides and metal nitrides. Resulting materials such as aluminium nitride (AlN) and zinc oxide (ZnO) could be highly attractive for the development of piezoelectric devices, whereas tantala (Ta2O5) and hafnia (HfO2) are well-known as high-k dielectric materials for power electronics.

  • Max substrate size 3″ wafers.
  • Si and Zr targets available.
  • Oxides and Nitrides based on the target materials.
  • Upcoming targets: Al, Ta, Hf, Zn, ITO, and AZO.
  • Room temperature depositions.

PlasmaCoat’s targets can be also made of alloys, e.g., aluminium doped zinc (Al:Zn) or indium doped tin (In:Sn), which allows the deposition of transparent conductive oxides, such as aluminium doped zinc oxide (AZO) and indium doped tin oxide (ITO). The PlasmaCoat is a relatively simple system capable to deposit not only high quality metallic and semiconductor thin films, but also to fabricate distributed Bragg’s reflectors (DBRs) which consist of a complex structure formed from multiple layers of alternating materials with different refractive index.

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Other tools & Equipment

  • PlasmaEtch Asher – Ash system for surface treatment with inert and Oxygen gases.
  • Carbolite Furnace – High temperature furnace with controlled atmosphere (up to 1200ºC)
  • Memmert Ovens – for long thermal treatments at medium temperatures
  • Silhouette Camaleo x2 – Mask fabrication on flexible substrates by cutting digital designs
  • Freeze-Dryer for sample preparation
  • Spinners for spin coating of resists or other solutions