DAD3350 Dicing Saw (ANALOGUE project) can handle a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. Through condition monitoring the processing conditions and various other statuses can be known at any given time.

CAPABILITIES: Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity.

DAG 810 Grinder (ANALOGUE project) is a precision grinding machine to remove the material from the workspace, enabling thinned microelectronic devices such as sensors, implantable, and quantum circuits. As an example, implantable devices such as neural probes applications (EP/X017516/1), require a precise and smooth finish to prevent damage to tissue. In wearables (EP/X034690/1), dies can be automatically thinned to improve mechanical resilience and flexibility, with improved reproducibility. 

Hesse-BJ653 Wire Bonder (ANALOGUE project) is an automated wire bonder that attaches fine wires, e.g. gold or aluminium, to nanoelectronic dies with high precision, throughput, reliability, and substrate-compatibility. Reducing manual intervention eliminates human error and improves the accuracy and consistency of the bonds with a high yield, required for sensors, quantum circuits, and RF micro-systems.  

Royce-600-Series-Bond-Tester (ANALOGUE project) is used to validate the quality and reliability of bonded dies and wires, underpinning research on the reliability of nanoelectronics. Sensors, healthcare, and medical devices often use wire bonding to connect the sensing elements to the rest of the device. Testing the wire bonds’ quality and strength ensures the sensor/devices can accurately and reliably detect the intended physical quantity. 

• AUTOLAB Potentiostat / galvanostat – Electrochemistry techniques

• Spectrophotometer – Optical characterization of thin filmd and solutions

• Fiber interferometer – Optical interference measurements

• Ultrasonics Vibrometer controller

• Piezo test meter system (D33 measurements)