ANALOGUE
ANALOGUE: Automated Nano AnaLysing, characterisatiOn and additive packaGing sUitE. Funded by EPSRC [£3M]. EPSRC Strategic Equipment funds. Three years: 2024-2027.
KEY STAFF AND PROJECT TEAM
Dr. Bhavani Yalagala is the Research Manager and technical lead on the ANALOGUE project, working under the supervision of Prof. Hadi Heidari as PI. As well as helping write the proposal, his responsibilities have included: purchase of all required equipment; management of ‘tendering’ processes; cleanroom establishment; equipment installations; training PhD/ECRs; website creation and maintenance; integration with JWNC; showcasing ANALOGUE at various events; some research activities related semiconductor packaging; and crucially, establishing partnerships with various companies.
Many colleagues from JWSE have been involved in or have supported the project, including academics working (primarily) in what can be termed ‘Medical Nanoelectronics’ and ‘Industrial Nanoelectronics’ user groups. They represent an extensive range of specialisms, and include:
Prof Manuel Salmeron-Sanchez, Dr Morteza Amjadi, Dr John Mercer, Prof Muhammad Imran, Dr Qingshen Jing, Prof David Cumming, Prof Jon Cooper , Dr Julien Reboud, Professor Qammer Abbasi, Prof. Sandy Cochran’s, Dr Kwok Ho Lam, Prof Margaret Lucas, and Dr Andrew Feeney. In quantum technology, key contributors are Prof Martin Weides, Prof Marc Sorel, Professor Chong Li, Dr Kaveh Delfanazari, Prof Edward Wasige, Prof Shan Kumar, Dr Daniel Mulvihill.
PROJECT SUMMARY AND OVERVIEW
Analogue proposes establishing an automated suite for nanoelectronics characterisation, assembly, and additive packaging at the University of Glasgow (UofG) with remote access and automation capabilities (Fig. 1). The research suite will provide an ideal research ecosystem when paired with the world-leading nanofabrication facilities in the James Watt Nanofabrication Centre (JWNC). This suite affords an opportunity to democratise research by making it accessible from any location and gives users greater control and information over the design and integration process, which will inform and enhance the development of future products. ANALOGUE is supported by an outstanding team balancing experienced and early career academics. ANALOGUE will deliver strategic value to local and regional clusters in nanoelectronics, as evidenced by the letters of support (LoS), from key UK partners.
AIMS AND OBJECTIVES
ANALOGUE will be the only research-accessible facility in the UK to integrate on-wafer electrical (parameter analysis, power, mixed-signal measurements), automated backend processing and additive heterogeneous (3D additive and vertical circuit printing, system integration, die and wire bonding). The constituent modules can operate individually or collectively and are built in a single automated room with control software and cameras to allow remote monitoring of them. Thus, we will push the boundaries of modern manufacturing of application-specific integrated circuit (ASIC) technology to widen its applications. Using system automation, the facility will allow for remote working, higher throughput experimentation, and improve batch-to-batch consistency, as well as real-time process monitoring and intelligent production scheduling, allowing for new platforms for sustainable electronic fabrication. Therefore, a smaller production footprint and less auxiliary equipment are required, lowering maintenance costs and the environmental impact of these processes. The third-party systems will be integrated within co-designed hardware and overarching control software and will support agile integration/assembly options and real-time analysis in-situ. This allows us to inform better processes, enable remote usage, and improve device modelling, reliability and sustainability aspects.
| Equipment | Description | |
| 1 | Automated wafer prober (AWP) | AWP provides increased efficiency, throughput and repeatability of measurements and offers high-precision placement of up to 1µm, temperature control to ±1°C, multiple wafer loading. Thus, enabling device validation and reliability research in a constrained timeframe. For instance, EPSRC projects related to quantum circuits (EPIQC), would leverage an AWP to accelerate testing and debugging. Quantum circuits are highly sensitive to noise and environmental factors requiring a controlled and repeatable test environment, enabling multiple designs to be rapidly characterised and optimised. |
| 2 | Automatic surface grinder (ASG) | The ASG is a precision grinding machine to remove the material from the workspace, enabling thinned microelectronic devices such as sensors, implantable, and quantum circuits. As an example, implantable devices such as neural probes applications (EP/X017516/1), require a precise and smooth finish to prevent damage to tissue. In wearables (EP/X034690/1), dies can be automatically thinned to improve mechanical resilience and flexibility, with improved reproducibility. |
| 3 | 3D Heterogen-ous Additive Printer | Additive 3D functional packaging enables the integration of bare dies, as well as stacked and vertical interconnects, including “many-layered” printed circuits, beyond traditional PCB tech and laminates. The µm-scale resolution over a large area enables sustainable circuits ranging from implants to packaged quantum computers. Transient circuits can also be realised using non-metal conductors. |
| 4 | Automatic die bonder | An automatic die bonder is required for placing dies, or components onto substrates/PCBs. For instance, magnetic sensors (EP/X031950/1) need the automatic die bonder to place the sensor array at the exact location required for optimal sensory performance. The die bonder supports micro-sensors and IC research, where reproducibility and reliability are an essential element in the research and large numbers of experiments are needed to optimise new bonding, substrate or semiconductor materials. |
| 5 | Automated wire bonder | The automated wire bonder attaches fine wires, e.g. gold or aluminium, to nanoelectronic dies with high precision, throughput, reliability, and substrate-compatibility. Reducing manual intervention eliminates human error and improves the accuracy and consistency of the bonds with a high yield, required for sensors, quantum circuits, and RF micro-systems. |
| 6 | Bond Tester | Bond testers validate the quality and reliability of bonded dies and wires, underpinning research on the reliability of nanoelectronics. Sensors, healthcare, and medical devices often use wire bonding to connect the sensing elements to the rest of the device. Testing the wire bonds’ quality and strength ensures the sensor/devices can accurately and reliably detect the intended physical quantity. |
| 7 | Lock-in Amplifier | This measures small signals produced by physical phenomena in sensors, e.g. temperature changes or magnetic fields. As an example, lock-in amplifiers will help extract small signals from quantum devices, to measure signals produced by electronic components to improve the device’s performance. The lock-in amplifier supports a wide frequency range of DC-8.5 GHz down to sub-nV accuracy. |
| Source measure-ment unit (SMU) | SMUs offer extremely accurate control and measurement of both voltage and current levels, allowing for precise characterization of the device under test. SMUs can be used to test a wide range of devices, from simple passive components to complex integrated circuits, sensors, semiconductor devices, and electronic systems. | |
| Mixed Domain Multi-Channel Oscilloscope | Oscilloscopes allow analysis and debugging of complex electronics that involve multiple signals and domains (e.g., analog, digital, and frequency). The simultaneous multi-domains acquisition provides a comprehensive view of the system and helps identify problems that may not be visible with traditional oscilloscopes. Thus, complex Mixed-signal ASICs for biomedical and quantum hardware applications can be characterised in less time and reduce the need for additional test equipment. |
NEWS AND UPDATES
Dr Yalagala is currently finalising a Semi-Cleanroom ISO7 standard with a sophisticated and high-end advanced semiconductor packaging and heterogenous integration facilities. Many potential collaborators have already expressed interest and provided support letters.
A successful networking event to introduce the project happened in September 2024: University of Glasgow – Research – Research units A-Z – ANALOGUE – Advanced Semiconductor Packaging Facility – News and Events and there will be more events forthcoming.
PUBLICATIONS AND PRESS
There are no publications on the initiative at this time. News stories include:
Glasgow University gets £3m for semiconductor push – Scottish Financial Review
Glasgow University gets £3m grant for IC packaging research | Electronics Weekly